In an exciting development for mobile chipsets, Qualcomm and MediaTek are rumored to be catching up with Apple in terms of technology. The companies are expected to announce their Snapdragon 8 Gen 4 and Dimensity 9400 chipsets next year, utilizing TSMC's cutting-edge 3nm process.

According to a tipster, both Qualcomm and MediaTek will leverage TSMC's advanced 3nm process for their upcoming chipsets. This move comes after Qualcomm and MediaTek opted for TSMC's N4P process this year, steered away from Apple's choice of the more expensive 3nm 'N3B' node. However, TSMC's N3E technology is believed to offer better yields and reasonable pricing.

While MediaTek has already announced its partnership with TSMC for volume production of their unnamed silicon starting in 2024, Qualcomm is yet to make an official announcement. It is expected that their Snapdragon 8 Gen 4 will also take advantage of the same 3nm fabrication process as the Dimensity 9400.

Notably, the tipster highlighted that the Snapdragon 8 Gen 4 will feature Qualcomm's custom Oryon cores. However, not much information was provided about the Dimensity 9400, with the tipster describing it as "restrained" without further elaboration. This may suggest that the chipset might not offer significant performance gains relative to its power consumption, although conclusions cannot be drawn until the Dimensity 9300 is unveiled.

One aspect that might concern smartphone manufacturers is the potential high cost of the Snapdragon 8 Gen 4 and Dimensity 9300 due to being mass-produced on TSMC's 3nm process. A Qualcomm executive has already hinted that the use of custom Oryon cores will make the Snapdragon 8 Gen 4 more expensive than its predecessor, the Snapdragon 8 Gen 3. As a result, phone makers may need to consider adjusting their margins or potentially raising prices for their Android flagship devices in 2024.

The introduction of these new chipsets by Qualcomm and MediaTek signals an exciting advancement in the race for mobile chip technology. With TSMC's cutting-edge 3nm process, both companies aim to bridge the gap with Apple and deliver improved performance, power efficiency, and overall user experience in their upcoming offerings. As more details emerge, tech enthusiasts and smartphone users eagerly await the unveiling of the Snapdragon 8 Gen 4 and Dimensity 9400 chipsets in the coming year.