**Sunnyvale Selected for New CHIPS for America R&D Facility**

The Biden-Harris Administration has selected Sunnyvale, California, as the site for the new CHIPS for America Design and Collaboration Facility (DCF), a significant development in the U.S. semiconductor landscape. The DCF will be an integral component of the National Semiconductor Technology Center (NSTC), aiming to drive forward innovation, research, and collaboration in semiconductor technology.

Announced by the Department of Commerce and Natcast, the operator of the NSTC, the Sunnyvale facility is a key part of President Biden’s Investing in America initiative. This national effort seeks to fortify the U.S. semiconductor supply chain, push forward cutting-edge research and development, and create quality jobs nationwide. The new facility will bring together NSTC members from across the semiconductor ecosystem to tackle key challenges in the microelectronics industry, including workforce development and secure access to cloud services.

Secretary of Commerce Gina Raimondo emphasized the critical role of R&D in the long-term national security and technological competitiveness of the U.S. "With this proposed facility, CHIPS for America is providing cutting-edge research, tools, and workforce opportunities to communities across the country," Raimondo said.

Situated in Silicon Valley's bustling semiconductor design environment, the Sunnyvale-based DCF will be a multifunctional hub. It will spearhead research in chip design, electronic design automation, chip and system architecture, and hardware security. Additionally, it will host the NSTC Workforce Center of Excellence, Design Enablement Gateway, and a future Investment Fund, providing a collaborative space for NSTC members and stakeholders.

Under Secretary of Commerce Laurie E. Locascio highlighted the collaborative potential of the new facility, stating that it will aid researchers, educators, and companies nationwide in solving pressing semiconductor industry challenges. Deirdre Hanford, Natcast CEO, echoed these sentiments, noting the importance of the Silicon Valley environment for fostering innovation and collaboration.

This new facility will enable industry leaders, academia, investors, and government partners to work together, leveraging both physical and digital assets to develop the next generation of semiconductor technologies, such as AI and 5G. It joins other significant CHIPS for America initiatives, including the EUV Accelerator and the NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility.

Further details regarding the selection process for affiliated technical centers will be disclosed at a later date, with additional information available on the NSTC and CHIPS for America R&D facilities.