Intel and Amazon Web Services Collaborate to Develop Custom AI and Xeon Chips, Boosting U.S. Semiconductor Manufacturing
ICARO Media Group
In an exciting development, Intel Corp. and Amazon Web Services (AWS) have announced a significant co-investment in custom chip designs. This multi-year, multi-billion-dollar collaboration aims to enhance the performance of artificial intelligence (AI) applications and empower customers to handle diverse workloads efficiently.
Under this expanded partnership, Intel will manufacture an AI fabric chip for AWS on Intel 18A, its most advanced process node. Additionally, Intel plans to produce a custom Xeon 6 chip on Intel 3, building upon their existing partnership in which Intel manufactures Xeon Scalable processors for AWS.
The CEO of Intel, Pat Gelsinger, expressed confidence in their process technology and its ability to deliver differentiated solutions for customer workloads. He emphasized that Intel's chip design and manufacturing capabilities, combined with the comprehensive cloud services, AI, and machine learning offerings of AWS, will drive innovation within their shared ecosystem. This collaboration also supports the growth of both businesses and the establishment of a sustainable domestic AI supply chain.
Matt Garman, the CEO of AWS, reaffirmed their commitment to delivering powerful and innovative cloud infrastructure to their customers. He highlighted their longstanding collaboration with Intel, dating back to 2006, and the continuous advancements in chip technology. Garman emphasized that co-developing next-generation AI fabric chips on Intel 18A will enable joint customers to run any workload effectively and unlock new AI capabilities.
Amidst this expanded collaboration, Intel and AWS are further accelerating semiconductor manufacturing in the United States and fostering a thriving AI ecosystem in Ohio. Intel's commitment to build leading-edge semiconductor manufacturing in the New Albany area, and AWS's plan to invest $7.8 billion to expand their data center operations in Central Ohio, demonstrate their dedication to U.S.-based manufacturing.
Ohio Governor Mike DeWine hailed this collaboration as a significant development for U.S.-based manufacturing and the positioning of Ohio as an AI leader. He commended Intel's commitment to domestic manufacturing sites and AWS's sustained investment in the state over the past decade.
The partnership between AWS and Intel spans over 18 years, aimed at providing organizations of all sizes with the tools and infrastructure to harness the cloud's potential. Both companies strive to reduce costs, simplify operations, enhance security, and scale computing capabilities to meet future demands. Moving forward, Intel and AWS will explore possibilities for additional designs based on Intel 18A and future process nodes.
This collaboration between Intel and AWS not only establishes them as industry leaders but also contributes significantly to the growth of U.S. semiconductor manufacturing. With a shared vision for technological advancement, the two companies are poised to drive innovation in AI and cloud computing, creating a brighter future for customers worldwide.
Please note that specific forward-looking statements in the source material are excluded from this generated article.